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siliconsemiconductor
16 小时
OptiMOS 6 135 V and 150 V MOSFETs enable higher efficiency in drives and SMPS applications
The OptiMOS 6 135 V and 150 V MOSFETs are available in a variety of packages to provide customers with a range of options for ...
siliconsemiconductor
16 小时
Discover innovative inspection solutions at electronica 2024
Test Research will join electronica 2024, which will be held at Messe München Center from November 12 – 15, 2024. Visit booth ...
siliconsemiconductor
1 天
Tech companies forge commercial links at SEMICON Taiwan
Rami Zakaria, VP of Sales & Marketing at IceMOS Technology Corporation, said: “Taiwan is one of the most important regions ...
siliconsemiconductor
1 天
Infineon and Oxford Ionics awarded contract to build a mobile quantum computer
Infineon Technologies AG and its technology partner Oxford Ionics Ltd. have been selected to build a mobile quantum computer ...
siliconsemiconductor
1 天
Mouser Electronics and Altium team up
Mouser Electronics and Altium have formed a new partnership to support electronics education and careers worldwide. This ...
siliconsemiconductor
2 天
TD Shepherd joins Silicon Catalyst
Silicon Catalyst, an incubator + accelerator exclusively focused on accelerating semiconductor solutions, says that TD ...
siliconsemiconductor
2 天
North Carolina State University orders Ion Beam Etching Equipment
scia Systems' scia Mill 200 system provides highly precise surface structuring of thin films with enhanced selectivity. scia Systems says that the North Carolina State University (NCSU) has purchased ...
siliconsemiconductor
2 天
Physik Instrumente aims to triple capacity
“PI has been on a steady growth path for years. With the new building, we are meeting our customers' increasing demands for ...
siliconsemiconductor
2 天
Infineon introduces the XENSIV PAS CO2 5V sensor
The XENSIV PAS CO2 5V provides accurate air quality data in real time. Its miniaturized form factor of 14x13.8x7.5 mm³ is ...
siliconsemiconductor
2 天
Chiplet Summit 2024 shows how advanced packaging keeps Moore’s Law alive
Chiplet Summit helps educate both design and packaging engineers. The advanced packaging tutorial covers methods such as 3D, ...
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