Indeed, both Besi and ASMPT have reported substantial order volumes for 2.5D/3D packaging equipment as well as hybrid bonding systems supported by AI servers and high-bandwidth memory (HBM). These ...

The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, has published the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches ...

Trump has pledged to turn the US into a manufacturing superpower through reshoring. But when it comes to semiconductors the ...