Semiconductor Packaging News
网页September 30, 2024. Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years. Global spending on 300mm fab equipment is set to hit $400 billion from 2025 to 2027, driven by AI chip demand and regional semiconductor fabs. SEMI’s forecast predicts a 24% rise in spending by 2025, reaching $123.2 ...
Semiconductor Packaging News Index
网页Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years. Global spending on 300mm fab equipment is set to hit $400 billion from 2025 to 2027, driven by AI chip ... SEMI. Sep 30, 2024. SUMMARY.
Semiconductor Packaging News
网页Japan's Semiconductor Equipment Sales Boom, Hit Record High for January-August This Year. Japan's semiconductor equipment sales surged in August 2024, rising 22% year-on-year to ¥351.06 billion, marking five months of double-digit growth. Sales for January-August hit ¥2.831 trillion, a 17.3% increase, setting a new all-time record.
Semiconductor Packaging News
网页Broadcom says it will sell $12 billion in AI parts and custom chips this year. Broadcom exceeded Wall Street's third-quarter expectations for revenue and earnings, but a $1.88 billion net loss from a tax provision led to a 7% drop in shares. Despite strong AI and semiconductor sales, revenue guidance met expectations at $14 billion.
US bets on AI to develop sustainable materials, strengthen ...
网页1 天前 · The U.S. Department of Commerce launched a $100 million initiative under the CHIPS for America program to advance sustainable semiconductor manufacturing using AI-powered autonomous experimentation. The program aims to accelerate the development of eco-friendly materials and bolster U.S. leadership in semiconductor technology. Digitimes.
TSMC’s Plan For Closing The Communication Gap
网页1 天前 · TSMC’s North American OIP Ecosystem Forum showcased its innovation roadmap, with N3E in production and N2 planned for 2025. The event emphasized collaboration and tackled the growing compute-memory communication gap, highlighting advances like TSMC's Compact Universal Photonic Engines (COUPE ...
Biden signs bill cutting environmental reviews for semiconductor …
网页1 天前 · President Biden signed a bill exempting semiconductor manufacturing facilities from environmental reviews, speeding up key sectors like clean energy. Despite support for boosting innovation, opponents, including environmental groups, warn of potential hazards from toxic waste, particularly PFAS chemicals linked to health risks. The Hill.
Will 2024 be the Year of Advanced Packaging?
网页Will 2024 be the Year of Advanced Packaging? IDTechEx's report highlights how advanced packaging technologies like 2.5D & 3D are boosting semiconductor innovation. These methods improve chiplet integration & system performance, paving the way for breakthroughs in AI, 5G & data centers despite material & cost challenges.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
网页A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this summary for your ...
Chip Industry Week In Review
网页5 天之前 · Chip Industry Week In Review. Global spending on 300mm fab equipment could hit $400 billion by 2027, driven by AI chip demand and semiconductor fab regionalization, especially in China, South Korea, and Taiwan. The U.S. launched major semiconductor workforce initiatives, while Qualcomm considers acquiring Intel amidst industry shifts.